Seals buy common sense of one-component epoxy-modified products

A density ranging from 1.1 to 2.8, the curing time is 50 degrees / 4 hours or 110 degrees / 30 minutes or 110 degrees / 50 minutes;
2 has a moderate thixotropic, Phi complex on the circuit board for electronic components can be covered and wrapped glue overcome on their own, but not flowing, bake curing process is not flowing,security seal keep the original shape;
3 cured black or amber light on the circuit board and electronic components adhesive power, and resistance to high temperature 200-300 ℃ and strong acid corrosion and erosion resistance to various solvents;
4 high adhesive strength, good heat resistance, excellent solvent resistance, adhesion strength can reach the device damage, damage to the device's temperature can be cured product from professional solvent erosion, and electronic circuit can element to get favorable protection to prevent technology leakage inside the device;
5 This product suitable for potting electronic devices confidentiality, after curing with a strong solvent resistance, can withstand long-term immersion of the organic solvent;luggage seals with a high heat distortion temperature, resistance to heat damage; also has good hardness and resistance to wear resistance, resistance to general cutting etch destruction.
6 potting electronic circuits using this product, with excellent anti-decryption sex.
7 product easy to use, long shelf life, high bonding strength, fast curing, low shrinkage, non-toxic characteristics.
8 70 days stored at room temperature, refrigerator storage than six months.